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High thermal conductivity alloy Product List

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High thermal conductivity alloy for die casting "HT-1"

Aluminum development alloys suitable for components that require heat dissipation characteristics, such as computers and game consoles!

"HT-1" is a die-casting high thermal conductivity alloy that achieves high thermal conductivity not possible with conventional aluminum alloys. With a silicon content of 12-14%, it has one of the best fluidities among die-casting alloys, allowing the molten metal to flow into thin sections. 【Features】 ■ Achieves high thermal conductivity ■ Has top-class fluidity ■ Resistant to seizure ■ Good castability, improving product yield *For more details, please download the PDF or feel free to contact us.

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High thermal conductivity alloy for die casting 'HT-2'

An aluminum development alloy suitable for components that require heat dissipation characteristics, such as heat sinks and heat receiving blocks for electronic devices!

"HT-2" is a high thermal conductivity alloy for die casting composed of Al-2%Fe-1%Cu. Fe provides anti-seizing effects, while Cu enhances strength. To achieve high thermal conductivity, the content of impurities is kept low. 【Features】 ■ Composition: Al-2%Fe-1%Cu - Fe: Anti-seizing effect - Cu: Strength enhancement effect ■ High thermal conductivity is achieved without heat treatment ■ Test pieces do not seize to the mold ■ No cracking occurs, and it fills thin-walled molds as well *For more details, please download the PDF or feel free to contact us.

  • alloy
  • Other electronic parts
  • High thermal conductivity alloy

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